Pressure Drop Characteristics of Circuit Board with Arrays of LSI Packages.
نویسندگان
چکیده
منابع مشابه
Heat Transfer and Pressure Drop Characteristics in Straight Microchannel of Printed Circuit Heat Exchangers
Performance tests were carried out for a microchannel printed circuit heat exchanger (PCHE), which was fabricated with micro photo-etching and diffusion bonding technologies. The microchannel PCHE was tested for Reynolds numbers in the range of 100‒850 varying the hot-side inlet temperature between 40 °C–50 °C while keeping the cold-side temperature fixed at 20 °C. It was found that the average...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B
سال: 1993
ISSN: 0387-5016,1884-8346
DOI: 10.1299/kikaib.59.1244